These tools are utilized extensively in failure analysis to access solder joint interconnect quality, plated through hole plating quality, to identify particle diffusion throughout the intermetallic layer, and examining contaminates and foreign particles.
SEM analysis creates high magnification electron micrographs having an upper limit of nearly 500,000x. Elemental composition is determined using EDS analysis. EDS identifies different chemical elements by measuring the individual energy and intensity X-ray signals given off by projecting an electron beam on the sample. S T and S Group sputters with Pd allowing evaluation of Au without additional Au being added.