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This can range from the simplest defect where by solder was not in contact with the device through more complicated and subtle issues such as plating passivation, oxidation of the surface finish, incorrect profile, expired solder past and or flux.
Device failure can be as simple as depanelization stress fractures, infant mortality issues from manufacturing or the result of electrical overstress. Extensive knowledge of how these components are manufactured differentiates us from other labs.
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